[ Visual & Dimensional Check ] │ ▼ [ Insertion Force Test ] │ ▼ [ Mechanical / Environmental Stress ] ──► (Thermal Shock, Vibration, Climatic) │ ▼ [ Electrical Resistance ] │ ▼ [ Push-out Force Test ]
Applies to electrical press-in connections for use in telecommunication equipment, data processing units, and electronic devices using similar technologies.
Provides a means of comparing results even when using tools from different manufacturers. IEC Webstore Key Technical Requirements Requirement Details Mechanical Procedures for measuring press-in force push-out force
IEC 60352-5 is part of the broader IEC 60352 series, which deals with solderless connections. Specifically, Part 5 focuses on (also known as "压入式连接" in Chinese). The standard establishes the general requirements, test methods, and practical guidance for such connections. iec 60352-5 pdf
To help me tailor any further technical specifications or testing details, could you share a bit more context?
Subjecting the assemblies to rapid temperature shifts to test whether mismatched thermal expansion between the metal pin and the FR4 board degrades the connection.
It is worth noting that IEC 60352-5 incorporates in addition to the formal test procedures. This practical guidance helps manufacturers avoid common pitfalls that pure theory would not reveal. [ Visual & Dimensional Check ] │ ▼
Yes, indirectly. The 5th edition’s broadened scope (electrical and electronic equipment and components) and the inclusion of definitions for “board” and “metal board” imply that rigid‑flex and other advanced board types are covered, provided they meet the generic requirements.
Precise dimensional tolerance tables for different pin sizes. Official test sequences and strict pass/fail criteria. How to Obtain the PDF Legally
is the international standard governing solderless press-in connections (often called press-fit) used in electrical and electronic equipment . The current version is Edition 5.0 (2020) , which replaced the previous 2012 edition. Overview of the Standard Specifically, Part 5 focuses on (also known as
This comprehensive guide breaks down the core elements of the IEC 60352-5 standard. It covers its scope, critical design requirements, testing procedures, and practical implications for high-reliability electronics manufacturing. What is IEC 60352-5?
Minimum copper plating thickness in the hole is strictly defined (typically a minimum of 25 µm) to prevent the barrel from cracking during insertion.